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Multi-screen wars: MediaTek/Mstar vs. Qualcomm, Marvell, Nvidia
The larger significance of the merging of Taiwan’s “M Brothers” may have escaped the notice of some western observers.
EET ON THE QT
October 2011
Biting into the New Silicon Sandwich
Next-generation chip packaging technology using through-silicon vias is on the way. Leading players, expecting to wring competitive advantage from early market entry, are already well along in mastering the technical challenges and forming key partnerships.
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- Apple computer
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- Toshiba
- Elpida
- Qualcomm
- Avalanche
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- Renesas
- Adesto
- Avalanche
- Grandis
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