Issues

This story is featured in:

April 2011 Issue - EE Times Confidential

EXTRA!

Multi-screen wars: MediaTek/Mstar vs. Qualcomm, Marvell, Nvidia
The larger significance of the merging of Taiwan’s “M Brothers” may have escaped the notice of some western observers.

MARKET DATA



August 2011

'Mid-End' Foundries Alter Advanced Packaging Landscape

Smaller form factors, improved performance and reduced cost are the key drivers behind the rush to 3-D packaging for ICs. The 3-D IC market could surpass the $4.5 billion mark by 2016.

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